Discover what’s next in sustainable automation at MODEX.
March 11-14, 2024, at the World Congress Center in Atlanta, Georgia.
Booth Number: A10921
Join us at MODEX as we share our vision for the future of end-of-line automation, including a path to improved total cost of ownership, labor efficiency, and right-sized packaging and reduced shipping costs. All while using the sustainable paper materials that Ranpak is known for.
Hear from our experts on site
March 13th Live Session: Pick to Shipper: Reduce touches & meet the coming parcel void regulations today!
Standard Theater H on Wednesday the 13th from 1:00-1:45PM
Ranpak’s Automation experts will share a live presentation detailing the critical need for right sized packaging and how automation can achieve maximum void reduction while reducing labor and shipping cost.
On Site Consultation: Experience how automation can transform your end-of-line packaging operation.
We invite you to come meet our team and experience a hands-on demonstration of our automation solutions, including our Cut’it! EVO height-reduction and AutoFill automated void fill machines. Use the form to schedule a consultation with our on-site team now at our booth A10921 in Hall A
Book a Meeting at MODEX 24
Don’t see a time that works for you? Email us directly to find a time that works.